Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer
By: Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang and Guibian Li
Language: English
Page range: 42 - 50
Submitted on: May 6, 2024
|Accepted on: Feb 9, 2025
|Published on: Mar 15, 2025
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2025 Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang, Guibian Li, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.