Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer
By: Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang and Guibian Li
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DOI: https://doi.org/10.2478/msp-2025-0004 | Journal eISSN: 2083-134X (formerly 2083-124X) | Journal ISSN: 2083-1331
Language: English
Page range: 42 - 50
Submitted on: May 6, 2024
Accepted on: Feb 9, 2025
Published on: Mar 15, 2025
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
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© 2025 Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang, Guibian Li, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.