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Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer Cover

Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer

Open Access
|Mar 2025

Figures & Tables

Figure 1

Morphology and phase composition of the clad powder. (a) Morphology of the clad powder before and after ball milling and (b) XRD phase analysis of the ball-milled Cu–Ti powder.

Figure 2

Laser cladding test equipment. Photograph (a) and schematic diagram (b).

Figure 3

Brazing and cladding test equipment (a) and brazing thermal evolution process (b).

Figure 4

Macromorphology of Cu cladding coated by (a) brazing and (b) laser [12].

Figure 5

Microstructure of Cu cladding coated by (a) brazing and (b) laser.

Figure 6

Scanning results of the interface points of brazing between the ceramic and Cu cladding.

Figure 7

Schematic diagram of the metallurgical reaction in the brazing transition layer.

Figure 8

Ti–Cu binary phase diagram [13].

Figure 9

Ti–Al binary phase diagram [13].

Figure 10

Phase analysis of Cu-coated metal layers on the ceramic surface under the atmosphere of Ar.

Figure 11

Scanning path of interface between the ceramic and Cu-coated layers by laser welding.

Figure 12

Metallurgical reaction diagram of the transition layer by laser cladding.

Laser cladding process parameters_

Laser parameterValue
Electric current200 A
Pulse width2.0 ms
Laser frequency4 Hz
Scanning speed355 mm/min
DOI: https://doi.org/10.2478/msp-2025-0004 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 42 - 50
Submitted on: May 6, 2024
|
Accepted on: Feb 9, 2025
|
Published on: Mar 15, 2025
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2025 Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang, Guibian Li, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.