Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer Cover

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Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer

Materials Science-Poland

Volume 43 (2025): Issue 1 (March 2025)

By: Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang and Guibian Li

Open Access

|Mar 2025

Authors

Song Wang

State Power Investment Group Yunnan International Power Investment Co., Ltd, Kunming, China

Hao Lu

School of Electrical Engineering, Xinjiang University, Urumqi, China

Fengyuan Shu

School of Chemical Engineering and Technology, Sun Yat sen University, Zhuhai, China

Xin Zhang

kmzx201@163.com

New Energy Technology Research Institute, State Power Investment Corporation Science and Technology Research Institute, Beijing, China

Guibian Li

Shanxi Fenglei Drilling Tools Co. Ltd., Houma, China

DOI: https://doi.org/10.2478/msp-2025-0004 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331

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Language: English

Page range: 42 - 50

Submitted on: May 6, 2024

|

Accepted on: Feb 9, 2025

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Published on: Mar 15, 2025

Published by: Wroclaw University of Science and Technology

In partnership with: Paradigm Publishing Services

Publication frequency: 4 issues per year

Keywords:

Laser cladding,

Ceramic substrate,

Elemental distribution,

Related subjects:

Materials sciences,

Materials sciences, other,

Functional and smart materials,

Materials characterization and properties

© 2025 Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang, Guibian Li, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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