Bonding mechanism between the AlN ceramic matrix and the copper-based metal cladding layer
By: Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang and Guibian Li
Authors
Song Wang
State Power Investment Group Yunnan International Power Investment Co., Ltd, Kunming, China
Hao Lu
School of Electrical Engineering, Xinjiang University, Urumqi, China
Fengyuan Shu
School of Chemical Engineering and Technology, Sun Yat sen University, Zhuhai, China
Xin Zhang
New Energy Technology Research Institute, State Power Investment Corporation Science and Technology Research Institute, Beijing, China
Guibian Li
Shanxi Fenglei Drilling Tools Co. Ltd., Houma, China
Language: English
Page range: 42 - 50
Submitted on: May 6, 2024
Accepted on: Feb 9, 2025
Published on: Mar 15, 2025
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Related subjects:
© 2025 Song Wang, Hao Lu, Fengyuan Shu, Xin Zhang, Guibian Li, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.