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Epoxy adhesive formulations using latent imidazole metal cation complexes Cover

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Epoxy adhesive formulations using latent imidazole metal cation complexes

Volume 13 (2011): Issue 1 (March 2011)

By: Ryszard Pilawka and Honorata Maka

Open Access

|Mar 2011

Authors

Ryszard Pilawka

Honorata Maka

Articles in this issue

DOI: https://doi.org/10.2478/v10026-011-0013-x | Journal eISSN: 3072-0389 (formerly 1899-4741) | Journal ISSN: 1509-8117

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Language: English

Page range: 63 - 66

Published on: Mar 17, 2011

Published by: West Pomeranian University of Technology, Szczecin

In partnership with: Paradigm Publishing Services

Publication frequency: Volume open

Keywords:

epoxy adhesives,

latent curing agent,

imidazole complexes,

Related subjects:

Industrial chemistry,

Chemical engineering,

Process engineering

© 2011 Ryszard Pilawka, Honorata Maka, published by West Pomeranian University of Technology, Szczecin
This work is licensed under the Creative Commons License.

Volume 13 (2011): Issue 1 (March 2011)

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