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Epoxy adhesive formulations using latent imidazole metal cation complexes Cover

Epoxy adhesive formulations using latent imidazole metal cation complexes

Open Access
|Mar 2011

References

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DOI: https://doi.org/10.2478/v10026-011-0013-x | Journal eISSN: 3072-0389 (formerly 1899-4741) | Journal ISSN: 1509-8117
Language: English
Page range: 63 - 66
Published online: Mar 17, 2011
Published in print: Jan 1, 2011
Published by: West Pomeranian University of Technology, Szczecin
In partnership with: Paradigm Publishing Services
Publication frequency: Volume open

© 2011 Ryszard Pilawka, Honorata Maka, published by West Pomeranian University of Technology, Szczecin
This work is licensed under the Creative Commons License.