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Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys Cover

Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

By: B. Yavuzer,  D. Özyürek and  T. Tunçay  
Open Access
|May 2020
DOI: https://doi.org/10.2478/msp-2020-0025 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 34 - 40
Submitted on: May 4, 2017
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Accepted on: Apr 23, 2019
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Published on: May 8, 2020
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2020 B. Yavuzer, D. Özyürek, T. Tunçay, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.