Have a personal or library account? Click to login
Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys Cover

Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys

Materials Science-Poland
Volume 38 (2020): Issue 1 (March 2020)
By: B. Yavuzer,  D. Özyürek and  T. Tunçay  
Open Access
|May 2020

Authors

B. Yavuzer

bekiryavuzer@gmail.com

Karabuk University, Technology Faculty, Turkey

D. Özyürek

Karabuk University, Technology Faculty, Turkey

T. Tunçay

Karabuk University, Technology Faculty, Turkey
DOI: https://doi.org/10.2478/msp-2020-0025 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Journal RSS Feed
Language: English
Page range: 34 - 40
Submitted on: May 4, 2017
|
Accepted on: Apr 23, 2019
|
Published on: May 8, 2020
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Sn-Zn lead-free alloys,
investment casting,
mechanical properties
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2020 B. Yavuzer, D. Özyürek, T. Tunçay, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Previous articleVolume 38 (2020): Issue 1 (March 2020)Next article