Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys
By: B. Yavuzer, D. Özyürek and T. Tunçay
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Language: English
Page range: 34 - 40
Submitted on: May 4, 2017
Accepted on: Apr 23, 2019
Published on: May 8, 2020
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2020 B. Yavuzer, D. Özyürek, T. Tunçay, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.