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Low-temperature plasma applications in chemical fungicide treatment reduction Cover

Low-temperature plasma applications in chemical fungicide treatment reduction

Acta Chimica Slovaca
Volume 13 (2020): Issue 1 (April 2020)
By: Lucia Hoppanová,  Veronika Medvecká,  Juliana Dylíková,  Daniela Hudecová,  Barbora Kaliňáková,  Svetlana Kryštofová and  Anna Zahoranová  
Open Access
|Jun 2020

Authors

Lucia Hoppanová

lucka.hopp@gmail.com

Institute of Biochemistry and Microbiology, Faculty of Chemical and Food Technology, Slovak University of Technology

Veronika Medvecká

Department of Experimental Physics, Faculty of Mathematics, Physics and Informatics, Comenius University

Juliana Dylíková

Institute of Biochemistry and Microbiology, Faculty of Chemical and Food Technology, Slovak University of Technology

Daniela Hudecová

Institute of Biochemistry and Microbiology, Faculty of Chemical and Food Technology, Slovak University of Technology

Barbora Kaliňáková

Institute of Biochemistry and Microbiology, Faculty of Chemical and Food Technology, Slovak University of Technology

Svetlana Kryštofová

Institute of Biochemistry and Microbiology, Faculty of Chemical and Food Technology, Slovak University of Technology

Anna Zahoranová

Department of Experimental Physics, Faculty of Mathematics, Physics and Informatics, Comenius University
DOI: https://doi.org/10.2478/acs-2020-0005 | Journal eISSN: 1339-3065 | Journal ISSN: 1337-978X
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Language: English
Page range: 26 - 33
Published on: Jun 29, 2020
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
Cereal seeds,
Chemical fungicide Vitavax 2000,
Decontamination,
Germination,
Low-temperature plasma
Related subjects:
Chemistry,
Chemistry, other

© 2020 Lucia Hoppanová, Veronika Medvecká, Juliana Dylíková, Daniela Hudecová, Barbora Kaliňáková, Svetlana Kryštofová, Anna Zahoranová, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution 4.0 License.

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