A fast and simple bonding method for low cost microfluidic chip fabrication
DOI: https://doi.org/10.1515/jee-2018-0010 | Journal eISSN: 1339-309X (formerly 1335-3632) | Journal ISSN: 1335-3632
Language: English
Page range: 72 - 78
Submitted on: Sep 11, 2017
Published on: Mar 7, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Related subjects:
© 2018 Zhifu Yin, Helin Zou, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.