A fast and simple bonding method for low cost microfluidic chip fabrication
Language: English
Page range: 72 - 78
Submitted on: Sep 11, 2017
|Published on: Mar 7, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
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© 2018 Zhifu Yin, Helin Zou, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.