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Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning Cover

Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning

Open Access
|May 2022
DOI: https://doi.org/10.30540/sae-2021-011 | Journal eISSN: 2657-6902 | Journal ISSN: 2081-1500
Language: English
Page range: 95 - 103
Published on: May 28, 2022
Published by: Kielce University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2022 Grzegorz Mazurek, Małgorzata Durlej, Marek Iwański, published by Kielce University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.