Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning
Authors
Małgorzata Durlej
Kielce University of Technology, Poland
Marek Iwański
Kielce University of Technology, Poland
Language: English
Page range: 95 - 103
Published on: May 28, 2022
Published by: Kielce University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2022 Grzegorz Mazurek, Małgorzata Durlej, Marek Iwański, published by Kielce University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.