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Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning Cover

Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning

Open Access
|May 2022

Authors

Grzegorz Mazurek

gmazurek@tu.kielce.pl

Kielce University of Technology, Poland

Małgorzata Durlej

Kielce University of Technology, Poland

Marek Iwański

Kielce University of Technology, Poland
DOI: https://doi.org/10.30540/sae-2021-011 | Journal eISSN: 2657-6902 | Journal ISSN: 2081-1500
Language: English
Page range: 95 - 103
Published on: May 28, 2022
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2022 Grzegorz Mazurek, Małgorzata Durlej, Marek Iwański, published by Kielce University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.