Numerical Modelling of Interlayer Adhesion in the Layer of Recycled Material with the Use of the Leutner Apparatus and Computed Tomography Scanning
Language: English
Page range: 95 - 103
Published on: May 28, 2022
Published by: Kielce University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Related subjects:
© 2022 Grzegorz Mazurek, Małgorzata Durlej, Marek Iwański, published by Kielce University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.