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Review of the electrodeposition of molybdenum carbide on the surfaces of disperse dielectric and semiconductor materials Cover

Review of the electrodeposition of molybdenum carbide on the surfaces of disperse dielectric and semiconductor materials

Open Access
|Dec 2012

References

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DOI: https://doi.org/10.2478/v10188-012-0021-3 | Journal eISSN: 1339-3065 | Journal ISSN: 1337-978X
Language: English
Page range: 139 - 144
Published on: Dec 14, 2012
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Related subjects:

© 2012 V. V. Malysheva, A.I. Gabb, D. B. Shakhnina, A. D. Pisanenkoa, M. Ambrovac, V. Danielikc, P. Fellnerc, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons License.