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Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel Cover

Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel

Materials Science-Poland
Volume 29 (2011): Issue 1 (March 2011)
By: Ahmet Yönetken,  Mehmet Çakmakkaya,  Ayhan Erol and  Şükrü Talaş  
Open Access
|Aug 2011

References

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DOI: https://doi.org/10.2478/s13536-011-0004-x | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 15 - 21
Published on: Aug 3, 2011
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
ceramic matrix composite,
electroless plating,
powder metallurgy,
diffusion bonding
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2011 Ahmet Yönetken, Mehmet Çakmakkaya, Ayhan Erol, Şükrü Talaş, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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