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Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel Cover

Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel

Open Access
|Aug 2011

Abstract

In this study, a composite containing WC (Tungsten Carbide) and Ni was produced by two different processing routes. Electroless Ni coated WC powders were consolidated and sintered at 1200 °C. Diffusion bonding couples of WC(Ni)-electrolytic Cu, WC(Ni)-AISI 316 stainless steel and WC(Ni)-WC(Ni) were manufactured by using a preloaded compression system under Ar atmosphere. Diffusion bonding was carried out at varying bonding temperatures; 750 °C for (WC)Ni-Cu diffusion couple and 1200 °C for (WC)Ni-(WC)Ni and (WC)Ni-AISI 316 stainless steel diffusion couples. Standard metallographic techniques, Scanning Electron Microscopy and a shear test were employed to characterize the microstructure of bondline and mechanical properties of each diffusion couple, respectively.

DOI: https://doi.org/10.2478/s13536-011-0004-x | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 15 - 21
Published on: Aug 3, 2011
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2011 Ahmet Yönetken, Mehmet Çakmakkaya, Ayhan Erol, Şükrü Talaş, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.