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Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel Cover

Diffusion bonding of electroless Ni plated WC composite to Cu and AISI 316 stainless steel

Open Access
|Aug 2011

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DOI: https://doi.org/10.2478/s13536-011-0004-x | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 15 - 21
Published on: Aug 3, 2011
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2011 Ahmet Yönetken, Mehmet Çakmakkaya, Ayhan Erol, Şükrü Talaş, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.