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Automatic Detection of Chip Pin Defect in Semiconductor Assembly Using Vision Measurement Cover

Automatic Detection of Chip Pin Defect in Semiconductor Assembly Using Vision Measurement

Measurement Science Review
Volume 22 (2022): Issue 5 (October 2022)
By: Shengfang Lu,  Jian Zhang,  Fei Hao and  Liangbao Jiao  
Open Access
|Aug 2022

Authors

Shengfang Lu

lshf14240@163.com

Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of Technology, Nanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of Technology, Nanjing, China

Jian Zhang

Shool of Information and Communication Engineering, Nanjing Institute of Technology, Nanjing, China

Fei Hao

Shool of Mechanical Engineering, Nanjing Institute of Technology, Nanjing, China

Liangbao Jiao

Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of Technology, Nanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of Technology, Nanjing, China
DOI: https://doi.org/10.2478/msr-2022-0029 | Journal eISSN: 1335-8871
Journal RSS Feed
Language: English
Page range: 231 - 240
Submitted on: Nov 25, 2021
Accepted on: May 22, 2022
Published on: Aug 5, 2022
Published by: Slovak Academy of Sciences, Institute of Measurement Science
In partnership with: Paradigm Publishing Services
Publication frequency: Volume open
Keywords:
3D reconstruction,
chip pin,
defect detection,
feature extraction,
computer vision
Related subjects:
Engineering,
Electrical engineering,
Control engineering, metrology and testing

© 2022 Shengfang Lu, Jian Zhang, Fei Hao, Liangbao Jiao, published by Slovak Academy of Sciences, Institute of Measurement Science
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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