Automatic Detection of Chip Pin Defect in Semiconductor Assembly Using Vision Measurement
By: Shengfang Lu, Jian Zhang, Fei Hao and Liangbao Jiao
Authors
Shengfang Lu
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of Technology, Nanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of Technology, Nanjing, China
Jian Zhang
Shool of Information and Communication Engineering, Nanjing Institute of Technology, Nanjing, China
Fei Hao
Shool of Mechanical Engineering, Nanjing Institute of Technology, Nanjing, China
Liangbao Jiao
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of Technology, Nanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of Technology, Nanjing, China
DOI: https://doi.org/10.2478/msr-2022-0029 | Journal eISSN: 1335-8871
Language: English
Page range: 231 - 240
Submitted on: Nov 25, 2021
Accepted on: May 22, 2022
Published on: Aug 5, 2022
In partnership with: Paradigm Publishing Services
Publication frequency: Volume open
Related subjects:
© 2022 Shengfang Lu, Jian Zhang, Fei Hao, Liangbao Jiao, published by Slovak Academy of Sciences, Institute of Measurement Science
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.