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Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation Cover

Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation

Open Access
|Aug 2020
DOI: https://doi.org/10.2478/mspe-2020-0031 | Journal eISSN: 2450-5781 | Journal ISSN: 2299-0461
Language: English
Page range: 213 - 219
Submitted on: Mar 1, 2020
Accepted on: Jul 1, 2020
Published on: Aug 17, 2020
Published by: STE Group sp. z.o.o.
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2020 Dawid Franke, Tomasz Suponik, Paweł M. Nuckowski, Klaudiusz Gołombek, Kamila Hyra, published by STE Group sp. z.o.o.
This work is licensed under the Creative Commons Attribution 4.0 License.