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Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation Cover

Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation

Management Systems in Production Engineering
Volume 28 (2020): Issue 4 (December 2020)
By: ,  ,  ,   and    
Open Access
|Aug 2020
Authors

Authors

Dawid Franke

dawid.franke@polsl.pl

Silesian University of Technology

Tomasz Suponik

tomasz.suponik@polsl.pl

Silesian University of Technology

Paweł M. Nuckowski

pawel.nuckowski@polsl.pl

Silesian University of Technology

Klaudiusz Gołombek

klaudiusz.golombek@polsl.pl

Silesian University of Technology

Kamila Hyra

kamilahyra.65@gmail.com

Silesian University of Technology
DOI: https://doi.org/10.2478/mspe-2020-0031 | Journal eISSN: 2450-5781 | Journal ISSN: 2299-0461
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Language: English
Page range: 213 - 219
Submitted on: Mar 1, 2020
Accepted on: Jul 1, 2020
Published on: Aug 17, 2020
Published by: STE Group sp. z.o.o.
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
electrostatic separation,
metals recovery,
PCB,
SEM,
XRD
Related subjects:
Business and economics,
Business management,
Management accounting, financial controlling, cost calculation, investment,
Engineering,
Mechanical engineering,
Production technology,
Tools and methods,
Process engineering and industrial engineering

© 2020 Dawid Franke, Tomasz Suponik, Paweł M. Nuckowski, Klaudiusz Gołombek, Kamila Hyra, published by STE Group sp. z.o.o.
This work is licensed under the Creative Commons Attribution 4.0 License.

Volume 28 (2020): Issue 4 (December 2020)
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