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Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology Cover

Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Open Access
|May 2024

Figures & Tables

Fig. 1.

Classification of vacuum gauges by operating principle/structure, based on [10–15]

Fig. 2.

Optical microscope imaging results: a) top view of the structure with the thickness testing trajectory (red line), b) thickness profile of the tested structure according to the set trajectory

Fig. 3.

Samples: a) before firing, b) after firing using different two-stage temperature profile

Fig. 4.

Structures of platinum bridge directly on Al2O3 substrate before firing: a) 1 SVM layer, b) 2 SVM layers

Fig. 5.

Structures of platinum bridge directly on alundum substrate after firing in a chamber furnace: a) 1 SVM layer, b) 2 SVM layers

Fig. 6.

Structures of platinum bridge directly on alundum substrate after belt furnace firing: a) 1 SVM layer, b) 2 SVM layers

Fig. 7.

Matrix of platinum bridges with different geometries: a) after application of carbon layer, b) after application of platinum layer, c) after firing

Fig. 8.

Platinum bridge structures on ceramic supports: a) design pattern, b) fired structures without the lamination process, c) fired structures with the lamination process before firing

Fig. 9.

One-sided structures: a) design pattern, b) unfired structures, c) fired structures

Fig. 10.

LTCC platinum bridges: a) after screen printing of the platinum layer, b) after the firing process

Fig. 11.

Surface characterization using SEM/Ga-FIB of FEI Helios Nanolab 600i (operating voltage and current of 1 kV and 86 μA, respectively) for Al2O3 samples: a) without etching and after etching for: b) 5 min, c) 10 min, d) 15 min, e) 30 min

Fig. 12.

Surface roughness profile of alundum substrates: a) before etching, b) after etching in KOH for 30 min and ?380 °C

Fig. 13.

Al2O3 wet etching process in KOH: a) structures before etching, b) acceptable result, c) unacceptable result

Fig. 14.

Schematic diagram of the bench for thermal measurements of a platinum thermionic cathode

Fig. 15.

Calibration curves of the measurement station using a thermal imaging camera

Fig. 16.

Temperature dependence of platinum planar structures as a function of applied electrical power

Fig. 17.

Experimental setup (emission performance)

Fig. 18.

Emission current vs thermionic cathode power

Results of thermal measurements for planar platinum structures

Supply current I [A]Supply voltage U [V]Power P [W]Structure temp. Without shutter T [°C]Structure temp. with shutter TSi [°C] = T·0.66925
Measurement with rapid temperature rise
0.333.051.01150100.39
0.393.941.54200133.85
0.465.432.48300200.78
0.506.833.41400267.70
0.558.424.63500334.63
Measurement with slow temperature rise
0.352.8470.99645150100.39
0.393.441.33200133.85
0.464.732.15300200.78
0.516.023.06400267.70
0.567.524.24500334.63
0.6119.005.50600401.55
0.6610.707.09700468.48

Calibration measurements for silicon shutter bench

Supply current I [A]Supply voltage U [V]Power P [W]Structure temp. without shutter T [°C]Structure temp. with shutter TSi [°C]Loss rate TSi/T [%]
0.333.051.00651509764.7
0.3863.941.5208420113567.2
0.455.432.443530020668.7
0.57.023.5140227267.1
Mean66.925
Standard deviation1.654
DOI: https://doi.org/10.2478/msp-2024-0007 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 126 - 139
Submitted on: Feb 5, 2024
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Accepted on: Apr 11, 2024
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Published on: May 22, 2024
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2024 Laura Jasińska, Krzysztof Dzbik, Damian Nowak, Krzysztof Stojek, Aleksandra Chudzyńska, Kamil Politański, Karol Malecha, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.