Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Laura Jasińska; Krzysztof Dzbik; Damian Nowak; Krzysztof Stojek; Aleksandra Chudzyńska; Kamil Politański; Karol Malecha

doi:10.2478/msp-2024-0007

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Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Materials Science-Poland

Volume 42 (2024): Issue 1 (March 2024)

By: Laura Jasińska, Krzysztof Dzbik, Damian Nowak, Krzysztof Stojek, Aleksandra Chudzyńska, Kamil Politański and Karol Malecha

Open Access

|May 2024

Abstract

This paper focuses on the development of a technological challenges of manufacturing the planar ceramic vacuum sensor based on the principles of hot-cathode ionization in the Bayard-Alpert configuration. The goal is to simplify the technological process by utilizing planar platinum structures with gold electrical paths instead of 3-dimensional structures. Various methods were tested, including the use of carbon-based SVM (Sacrifice Volume Materials) materials, but without success. Wet-etching using potassium hydroxide on Al₂O₃ substrates showed promise results. The findings highlight the challenges and progress made in developing the thermo-emittercomponent of the vacuum sensor.

References

Sullivan JJ. Development of Variable Capacitance Pressure Transducers for Vacuum Applications. J Vac Sci Technol A. 1985; 3: 1721–1730, doi:10.1116/1.573008
Open DOI Search in Google Scholar Back to article
Sun J; Hu D, Liu Z, Middelburg LM, Vollebregt S, Sarro PM, Zhang G. Low Power AlGaN/GaN MEMS Pressure Sensor for High Vacuum Application. Sens Actuators A Phys. 2020; 314: 112217, doi:10.1016/j.sna.2020.112217
Open DOI Search in Google Scholar Back to article
Kang S, Qian W, Liu R, Yu H, Zhu W, Liao X, Wang F, Huang W, Dong C. Miniature Vacuum Sensor Based on Gas Adsorptions from Carbon Nanotube Field Emitters. Vacuum. 2023; 207: 111663, doi:10.1016/j.vacuum.2022.111663
Open DOI Search in Google Scholar Back to article
Dawood NS, Zayer MQ, Jawad MF. Preparation and Characteristics Study of Porous Silicon for Vacuum Sensor Application. Karbala Int J Mod Sci. 2022; 8: 105–113, doi:10.33640/2405-609X.3209
Open DOI Search in Google Scholar Back to article
Zhang Y, Massoud-Ansari S, Meng G, Kim W, Najafi N. An Ultra-Sensitive, High-Vacuum Absolute Capacitive Pressure Sensor. In Proceedings of the Technical Digest. MEMS 2001. 14th IEEE Int Conf Micro Electro Mech Syst, 2001 Jan 21-25, 166–169, Interlaken (Switzerland).
Search in Google Scholar Back to article
Górecka-Drzazga A. Miniature and MEMS-Type Vacuum Sensors and Pumps. Vacuum. 2009; 83: 1419–1426, doi:10.1016/j.vacuum.2009.05.003
Open DOI Search in Google Scholar Back to article
Wang S, Feng Y. Micro Capacitive Vacuum Sensor Based on MEMS. In Proceedings of the 2010 IEEE 5th Int Conf Nano/Micro Eng Mol Syst; 2010 Jan 20-23, 1160–1164, Xiamen (China).
Search in Google Scholar Back to article
Liu C, Froemel J, Chen J, Tsukamoto T, Tanaka S. Laterally Vibrating MEMS Resonant Vacuum Sensor Based on Cavity-SOI Process for Evaluation of Wide Range of Sealed Cavity Pressure. Microsyst Technol. 2019; 25: 487–497, doi:10.1007/s00542-018-3984-1
Open DOI Search in Google Scholar Back to article
Madey TE. Early Applications of Vacuum, from Aristotle to Langmuir. J Vac Sci Technol A. 1984; 2: 110–117, doi:10.1116/1.572681
Open DOI Search in Google Scholar Back to article
Jousten K. Gauges for Fine and High Vacuum. CAS – CERN Accelerator School?: Vacuum in Accelerators. 2007; 65–86, doi:10.5170/CERN-2007-003.65
Open DOI Search in Google Scholar Back to article
Halas, A. Techn. Prózni; Wroclaw: Oficyna Wydawnicza Politechniki Wroclawskiej, 2017.
Search in Google Scholar Back to article
Roth A. Vacuum Technol. 3rd ed.; Amsterdam, Lausanne, New York, Oxford, Shannon, Tokyo: Elsevier Sci. B.V, 1990.
Search in Google Scholar Back to article
McMillen B, Jewart C, Buric M, Chen KP, Lin Y, Xu W. Fiber Bragg Grating Vacuum Sensors. Appl Phys Lett. 2005; 87: 234101, doi:10.1063/1.2140082
Open DOI Search in Google Scholar Back to article
Mironov AE, Yu N, Park S, Tuggle M, Gragg J, Kucera C, Hawkins T, Ballato J, Eden JG, Dragic P. All Optical Fiber Thermal Vacuum Gauge. J Phys Photonics. 2020; 2(1): 014006, doi:10.1088/2515-7647/ab60c5
Open DOI Search in Google Scholar Back to article
Xu J, Pickrell GR, Wang X, Yu B, Cooper KL, Wang A. Vacuum-Sealed High Temperature High Bandwidth Fiber Optic Pressure and Acoustic Sensors. Sensors for Harsh Environments II. Proc SPIE. 2005; 5998: 67–72, doi: 10.1117/12.630802
Open DOI Search in Google Scholar Back to article
Kendall BRF, Drubetsky E. Cold Cathode Gauges for Ultrahigh Vacuum Measurements. J Vac Sci Technol A. 1997; 15: 740–746, doi:10.1116/1.580813
Open DOI Search in Google Scholar Back to article
Peacock RN, Peacock NT, Hauschulz DS. Comparison of Hot Cathode and Cold Cathode Ionization Gauges. J Vac Sci Technol A. 1991; 9: 1977–1985, doi:10.1116/1.577439
Open DOI Search in Google Scholar Back to article
Li D, Jousten K. Comparison of the Stability of Hot and Cold Cathode Ionization Gauges. J Vac Sci Technol A. 2003; 21: 937–946, doi:10.1116/1.1578654
Open DOI Search in Google Scholar Back to article
Huang JX, Chen J, Deng SZ, Xu NS. A Bayard-Alpert Ionization Gauge Using Carbon Nanotube Cold Cathode. In Proceedings of the 2006 19th Int Vacuum Nanoelectronics Conf, 2006 Jul 17-20; Guilin (China).
Search in Google Scholar Back to article
Chung KH, Hong SS, Shin YH, Lim JY, Lee SK, Woo SY. Hot Cathode Ionization Gauge Calibration with the KRISS Ultra-High Vacuum Standards. Metrologia. 1999; 36: 675–679, doi:10.1088/0026-1394/36/6/37
Open DOI Search in Google Scholar Back to article
Bayard-Alpert Gauge Filaments: Tungsten or Thorina? Available online: https://www.thinksrs.com/downloads/pdfs/applicationnotes/IG1filamentsapp.pdf (accessed on January 19, 2024).
Search in Google Scholar Back to article
Baptist R, Bieth C, Py C. A Bayard-Alpert Vacuum Gauge with Microtips. In Proceedings of the IVMC ‘95. Eighth International Vacuum Microelectronics Conference. Technical Digest, 1995 Jul 30–Aug 3, 524–528; Portland (USA).
Search in Google Scholar Back to article
Golonka LJ. New Application of LTCC Technology. In: 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005 May 19-20, 162–166, Wiener Neustadt (Austria), doi:10.1109/ISSE.2005.1491020
Open DOI Search in Google Scholar Back to article
Peterson KA, Knudson RT, Garcia EJ, Patel KD, Okan-dan M, Ho CK, James CD, Rohde SB Rohrer BR, Smith F. LTCC in Microelectronics, Microsystems, and Sensors. In Proceedings of the 2008 15th International Conference on Mixed Design of Integrated Circuits and Systems; Vol. 2, 2008 Jun 19-21, 2008, Poznañ (Poland).
Search in Google Scholar Back to article
Jantunen H, Kangasvieri T, Vähäkangas J, Leppävuori S. Design Aspects of Microwave Components with LTCC Technique. J Eur Ceram Soc. 2003; 23: 2541–2548, doi:10.1016/S0955-2219(03)00155-9
Open DOI Search in Google Scholar Back to article
Grall S, Santawitee O, Dufour I, Aubry V, Debéda H. New Corn-Based Sacrificial Layer for MEMS Based on Screen-Printed PZT Ceramics. Sens Actuators A Phys. 2020; 304:111826. doi:10.1016/j.sna.2019.111826
Open DOI Search in Google Scholar Back to article
Malecha K, Maeder T, Jacq C, Ryser P. Structuration of the Low Temperature Co-Fired Ceramics (LTCC) Using Novel Sacrificial Graphite Paste with PVA–Propylene Glycol–Glycerol–Water Vehicle. Microelectronics Reliability. 2011; 51: 805–811. doi:10.1016/j.microrel.2010.11.009
Open DOI Search in Google Scholar Back to article
Malecha K, Maeder T, Jacq C. Fabrication of Membranes and Microchannels in Low-Temperature Co-Fired Ceramic (LTCC) Substrate Using Novel Water-Based Sacrificial Carbon Pastes. J Eur Ceram Soc. 2012; 32: 3277–3286. doi:10.1016/j.jeurceramsoc.2012.04.036
Open DOI Search in Google Scholar Back to article
Maeder T, Jacq C, Fournier Y, Hraiz W, Ryser P. Structuration of Thin Bridge and Cantilever Structures in Thick-Film Technology Using Mineral Sacrificial Materials. In Proceedings of the 5rd IMAPS/ACerS International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), 2009 Apr 21–23, Denver (USA).
Search in Google Scholar Back to article
Hrovat M, Belavic D, Cilensek J, Drnovsek S, Holc J, Jerlah M. Investigation of Sacrificial Layers for 3D LTCC Structures and Some Preliminary Results. In Proceedings of the 2009 32nd International Spring Seminar on Electronics Technology; 2009 May 13-17, Brno (Czech Republic)
Search in Google Scholar Back to article
Dąbrowski A, Nawrot W, Czok M, Babij M, Bielówka P, Malecha K. LTCC Strip Electrode Arrays for Gas Electron Multiplier Detectors. Sensors. 2022; 22: 623. doi:10.3390/s22020623
Open DOI Search in Google Scholar Back to article
Tachi S, Tsujimoto K, Arai S, Kure T. Low-Temperature Dry Etching. J Vac Sci Technol A. 1991; 9: 796–803. doi:10.1116/1.577364
Open DOI Search in Google Scholar Back to article
Knotter DM. The Chemistry of Wet Etching. In Handbook of Cleaning in Semiconductor Manufacturing; Wiley, 2010; pp. 95–141.
Search in Google Scholar Back to article
Nojiri K. Dry Etching Technology for Semiconductors. Tokyo: Springer Cham; 2015.
Search in Google Scholar Back to article
Zhuang D, Edgar JH. Wet Etching of GaN, AlN, and SiC: A Review. Mater Sci Eng R. 2005; 48: 1–46. doi:10.1016/j.mser.2004.11.002
Open DOI Search in Google Scholar Back to article
Ameen JG, McBride DG, Phillips GC. Etching of High Alumina Ceramics to Promote Copper Adhesion; J Electrochem Soc. 1973; 120(11): 1518. doi: 10.1149/1.2403295
Open DOI Search in Google Scholar Back to article
Pal P, Sato K. Fabrication Methods Based on Wet Etching Process for the Realization of Silicon MEMS Structures with New Shapes. Microsyst Technol. 2010; 16: 1165–1174. doi:10.1007/s00542-009-0956-5
Open DOI Search in Google Scholar Back to article
International Labour Organization International Chemical Safety Cards (ICSCs), Potassium Hydrooxide. Available online: https://www.ilo.org/dyn/icsc/showcard.home (accessed on January 19, 2024).
Search in Google Scholar Back to article

Articles in this issue

DOI: https://doi.org/10.2478/msp-2024-0007 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331

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Language: English

Page range: 126 - 139

Submitted on: Feb 5, 2024

Accepted on: Apr 11, 2024

Published on: May 22, 2024

Published by: Wroclaw University of Science and Technology

In partnership with: Paradigm Publishing Services

Publication frequency: 4 issues per year

Keywords:

alundum,

SVM,

Related subjects:

Materials sciences, other,

Nanomaterials,

Functional and smart materials,

Materials characterization and properties

© 2024 Laura Jasińska, Krzysztof Dzbik, Damian Nowak, Krzysztof Stojek, Aleksandra Chudzyńska, Kamil Politański, Karol Malecha, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 42 (2024): Issue 1 (March 2024)