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Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology Cover

Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Materials Science-Poland
Volume 42 (2024): Issue 1 (March 2024)
By: Laura Jasińska,  Krzysztof Dzbik,  Damian Nowak,  Krzysztof Stojek,  Aleksandra Chudzyńska,  Kamil Politański and  Karol Malecha  
Open Access
|May 2024

Authors

Laura Jasińska

Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Wrocław, Poland

Krzysztof Dzbik

Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Wrocław, Poland

Damian Nowak

Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Wrocław, Poland

Krzysztof Stojek

Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Wrocław, Poland

Aleksandra Chudzyńska

Nanores Sp. z o. o. Sp. k., Wrocław, Poland

Kamil Politański

Nanores Sp. z o. o. Sp. k., Wrocław, Poland

Karol Malecha

karol.malecha@pwr.edu.pl

Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Wrocław, Poland
DOI: https://doi.org/10.2478/msp-2024-0007 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 126 - 139
Submitted on: Feb 5, 2024
|
Accepted on: Apr 11, 2024
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Published on: May 22, 2024
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
alundum,
wet etching,
vacuum gauge,
SVM,
thick-film
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2024 Laura Jasińska, Krzysztof Dzbik, Damian Nowak, Krzysztof Stojek, Aleksandra Chudzyńska, Kamil Politański, Karol Malecha, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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