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Solidification microstructure in a supercooled binary alloy Cover

Solidification microstructure in a supercooled binary alloy

Open Access
|Dec 2021

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DOI: https://doi.org/10.2478/msp-2021-0031 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 383 - 394
Submitted on: Jun 18, 2021
Accepted on: Oct 11, 2021
Published on: Dec 18, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.