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Solidification microstructure in a supercooled binary alloy Cover

Solidification microstructure in a supercooled binary alloy

Open Access
|Dec 2021

Figures & Tables

Fig. 1

Undercooling process and calculation of under-cooling.
Undercooling process and calculation of under-cooling.

Fig. 2

The recalescence process of Ni82Cu18 alloy under different undercooling.
The recalescence process of Ni82Cu18 alloy under different undercooling.

Fig. 3

Maximum recalescence temperature of Ni82Cu18 alloy under different undercooling.
Maximum recalescence temperature of Ni82Cu18 alloy under different undercooling.

Fig. 4

High-speed video camera images of Ni82Cu18 alloy with different undercooling degrees (A) 60 K; (B) 140 K; (C) 194 K; (D) 220 K; (E) 250 K.
High-speed video camera images of Ni82Cu18 alloy with different undercooling degrees (A) 60 K; (B) 140 K; (C) 194 K; (D) 220 K; (E) 250 K.

Fig. 5

Microstructure of Ni82Cu18 alloy at different undercooling. (A) 30 K; (B) 60 K; (C) 76 K; (D) 100 K; (E) 120 K; (F) 155 K; (G) 170 K; and (H) 210 K.
Microstructure of Ni82Cu18 alloy at different undercooling. (A) 30 K; (B) 60 K; (C) 76 K; (D) 100 K; (E) 120 K; (F) 155 K; (G) 170 K; and (H) 210 K.

Fig. 6

Evolution of grain size of Ni82Cu18 alloy under different undercooling.
Evolution of grain size of Ni82Cu18 alloy under different undercooling.

Fig. 7

(A) Evolution of component undercooling with initial undercooling. (B) Evolution of dendrite tip radius and dendrite growth velocity with initial undercooling.
(A) Evolution of component undercooling with initial undercooling. (B) Evolution of dendrite tip radius and dendrite growth velocity with initial undercooling.

Fig. 8

Dendrite morphology at different undercooling (A) 25 K; (B) 45 K; (C) 150 K.
Dendrite morphology at different undercooling (A) 25 K; (B) 45 K; (C) 150 K.

Fig. 9

(A) Microstructure of Ni82Cu18 alloy at 210 K; (B) grain orientation of Ni82Cu18 alloy at 210 K; (C) the inverse pole figure of (B).
(A) Microstructure of Ni82Cu18 alloy at 210 K; (B) grain orientation of Ni82Cu18 alloy at 210 K; (C) the inverse pole figure of (B).

Fig. 10

(A) Grain boundaries of Figure 9b; (B) misorientation angle distribution of (A); (C) local misorientation of Figure 9b; (D) local misorientation distribution of (C); (E) recrystallization distribution of Figure 9b (blue is recrystallization, yellow is substructure and red is a deformed grain); (F) recrystallized fraction of (E).
(A) Grain boundaries of Figure 9b; (B) misorientation angle distribution of (A); (C) local misorientation of Figure 9b; (D) local misorientation distribution of (C); (E) recrystallization distribution of Figure 9b (blue is recrystallization, yellow is substructure and red is a deformed grain); (F) recrystallized fraction of (E).

Fig. 11

(A) The solid fraction at different undercooling; (B) Stress at different undercooling; (C, D) TEM bright field image of Ni82Cu18 alloy at 270 K.TEM, transmission electron microscope.
(A) The solid fraction at different undercooling; (B) Stress at different undercooling; (C, D) TEM bright field image of Ni82Cu18 alloy at 270 K.TEM, transmission electron microscope.

Fig. 12

(A) Hardness of Ni82Cu18 alloy at different undercooling; (B) Microstructure of Ni82Cu18 alloy at 210 K.
(A) Hardness of Ni82Cu18 alloy at different undercooling; (B) Microstructure of Ni82Cu18 alloy at 210 K.
DOI: https://doi.org/10.2478/msp-2021-0031 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 383 - 394
Submitted on: Jun 18, 2021
Accepted on: Oct 11, 2021
Published on: Dec 18, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.