Have a personal or library account? Click to login
Solidification microstructure in a supercooled binary alloy Cover

Solidification microstructure in a supercooled binary alloy

Materials Science-Poland
Volume 39 (2021): Issue 3 (September 2021)
By: Hongfu Wang,  Cheng Tang,  Hongen An and  Yuhong Zhao  
Open Access
|Dec 2021

Figures & Tables

Fig. 1

Undercooling process and calculation of under-cooling.

Fig. 2

The recalescence process of Ni82Cu18 alloy under different undercooling.

Fig. 3

Maximum recalescence temperature of Ni82Cu18 alloy under different undercooling.

Fig. 4

High-speed video camera images of Ni82Cu18 alloy with different undercooling degrees (A) 60 K; (B) 140 K; (C) 194 K; (D) 220 K; (E) 250 K.

Fig. 5

Microstructure of Ni82Cu18 alloy at different undercooling. (A) 30 K; (B) 60 K; (C) 76 K; (D) 100 K; (E) 120 K; (F) 155 K; (G) 170 K; and (H) 210 K.

Fig. 6

Evolution of grain size of Ni82Cu18 alloy under different undercooling.

Fig. 7

(A) Evolution of component undercooling with initial undercooling. (B) Evolution of dendrite tip radius and dendrite growth velocity with initial undercooling.

Fig. 8

Dendrite morphology at different undercooling (A) 25 K; (B) 45 K; (C) 150 K.

Fig. 9

(A) Microstructure of Ni82Cu18 alloy at 210 K; (B) grain orientation of Ni82Cu18 alloy at 210 K; (C) the inverse pole figure of (B).

Fig. 10

(A) Grain boundaries of Figure 9b; (B) misorientation angle distribution of (A); (C) local misorientation of Figure 9b; (D) local misorientation distribution of (C); (E) recrystallization distribution of Figure 9b (blue is recrystallization, yellow is substructure and red is a deformed grain); (F) recrystallized fraction of (E).

Fig. 11

(A) The solid fraction at different undercooling; (B) Stress at different undercooling; (C, D) TEM bright field image of Ni82Cu18 alloy at 270 K.TEM, transmission electron microscope.

Fig. 12

(A) Hardness of Ni82Cu18 alloy at different undercooling; (B) Microstructure of Ni82Cu18 alloy at 210 K.
DOI: https://doi.org/10.2478/msp-2021-0031 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Journal RSS Feed
Language: English
Page range: 383 - 394
Submitted on: Jun 18, 2021
|
Accepted on: Oct 11, 2021
|
Published on: Dec 18, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
alloy,
microstructure,
rapid solidification,
crystal growth
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Previous articleVolume 39 (2021): Issue 3 (September 2021)Next article