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Microstructure refinement mechanism of undercooled Cu55Ni45 alloys Cover

Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Materials Science-Poland
Volume 39 (2021): Issue 3 (September 2021)
By: Hongfu Wang,  Cheng Tang,  Hongen An and  Yuhong Zhao  
Open Access
|Dec 2021

Authors

Hongfu Wang

wanghongfu@nuc.edu.cn

School of Mechanical Engineering, North University of China, Taiyuan, China

Cheng Tang

School of Mechanical Engineering, North University of China, Taiyuan, China

Hongen An

Faculty of Engineering, University Malaysia Sabah, Kota Kinabalu, Malaysia

Yuhong Zhao

zhaoyuhong@nuc.edu.cn

College of Materials Science and Engineering, North University of China, Taiyuan, China
DOI: https://doi.org/10.2478/msp-2021-0027 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 319 - 330
Submitted on: Jun 28, 2021
|
Accepted on: Sep 16, 2021
|
Published on: Dec 7, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
solidification structure,
rapid solidification,
grain refinement,
recrystallization
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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