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Microstructure refinement mechanism of undercooled Cu55Ni45 alloys Cover

Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Materials Science-Poland
Volume 39 (2021): Issue 3 (September 2021)
By: Hongfu Wang,  Cheng Tang,  Hongen An and  Yuhong Zhao  
Open Access
|Dec 2021

Figures & Tables

Fig. 1

Schematic diagram of undercooling experimental device.

Fig. 2

Microstructure of Cu55Ni45 alloy under different undercooling degrees. [(A) ΔT = 47 K, (B) ΔT = 68 K, (C) ΔT = 70 K, (D) ΔT = 91 K, (E) ΔT = 187 K, (F) ΔT = 227 K, (G) ΔT = 272 K, (H) ΔT = 284 K].

Fig. 3

Solidification recalescence curve of Cu55Ni45 alloy.

Fig. 4

EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 5

The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.

Fig. 6

EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 7

(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.

Fig. 8

(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.
DOI: https://doi.org/10.2478/msp-2021-0027 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 319 - 330
Submitted on: Jun 28, 2021
|
Accepted on: Sep 16, 2021
|
Published on: Dec 7, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
solidification structure,
rapid solidification,
grain refinement,
recrystallization
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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