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Microstructure refinement mechanism of undercooled Cu55Ni45 alloys Cover

Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Materials Science-Poland
Volume 39 (2021): Issue 3 (September 2021)
By: Hongfu Wang,  Cheng Tang,  Hongen An and  Yuhong Zhao  
Open Access
|Dec 2021

Figures & Tables

Fig. 1

Schematic diagram of undercooling experimental device.
Schematic diagram of undercooling experimental device.

Fig. 2

Microstructure of Cu55Ni45 alloy under different undercooling degrees. [(A) ΔT = 47 K, (B) ΔT = 68 K, (C) ΔT = 70 K, (D) ΔT = 91 K, (E) ΔT = 187 K, (F) ΔT = 227 K, (G) ΔT = 272 K, (H) ΔT = 284 K].
Microstructure of Cu55Ni45 alloy under different undercooling degrees. [(A) ΔT = 47 K, (B) ΔT = 68 K, (C) ΔT = 70 K, (D) ΔT = 91 K, (E) ΔT = 187 K, (F) ΔT = 227 K, (G) ΔT = 272 K, (H) ΔT = 284 K].

Fig. 3

Solidification recalescence curve of Cu55Ni45 alloy.
Solidification recalescence curve of Cu55Ni45 alloy.

Fig. 4

EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 5

The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.
The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.

Fig. 6

EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 7

(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.
(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.

Fig. 8

(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.
(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.
DOI: https://doi.org/10.2478/msp-2021-0027 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 319 - 330
Submitted on: Jun 28, 2021
Accepted on: Sep 16, 2021
Published on: Dec 7, 2021
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
solidification structure,
rapid solidification,
grain refinement,
recrystallization
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2021 Hongfu Wang, Cheng Tang, Hongen An, Yuhong Zhao, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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