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Analysis of surface properties of Ti-Cu-Ox gradient thin films using AFM and XPS investigations Cover

Analysis of surface properties of Ti-Cu-Ox gradient thin films using AFM and XPS investigations

Materials Science-Poland
Volume 36 (2018): Issue 4 (December 2018)
By: Tomasz Kotwica,  Jaroslaw Domaradzki,  Damian Wojcieszak,  Andrzej Sikora,  Malgorzata Kot and  Dieter Schmeisser  
Open Access
|Feb 2019

Authors

Tomasz Kotwica

tomasz.kotwica@pwr.edu.pl

Faculty of Microsystem Electronics and Photonics, Wroclaw University of Science and Technology, Wroclaw, Poland

Jaroslaw Domaradzki

Faculty of Microsystem Electronics and Photonics, Wroclaw University of Science and Technology, Wroclaw, Poland

Damian Wojcieszak

Faculty of Microsystem Electronics and Photonics, Wroclaw University of Science and Technology, Wroclaw, Poland

Andrzej Sikora

Department of Material Science and Diagnostics, Electrotechnical Institute, Wroclaw, Poland

Malgorzata Kot

Applied Physics-Sensor Technology, Brandenburg, University of Technology Cottbus-Senftenberg, Cottbus, Germany

Dieter Schmeisser

Applied Physics-Sensor Technology, Brandenburg, University of Technology Cottbus-Senftenberg, Cottbus, Germany
DOI: https://doi.org/10.2478/msp-2018-0100 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 761 - 768
Submitted on: Nov 9, 2018
|
Accepted on: Nov 30, 2018
|
Published on: Feb 1, 2019
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
surface,
gradient distribution,
thin film oxide
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2019 Tomasz Kotwica, Jaroslaw Domaradzki, Damian Wojcieszak, Andrzej Sikora, Malgorzata Kot, Dieter Schmeisser, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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