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Improving the Ohmic Properties of Au/Ni–Mg/P–GaN Contacts by Adding Swcnt Metallization Interlayer Between Metal and P–GaN Layers Cover

Improving the Ohmic Properties of Au/Ni–Mg/P–GaN Contacts by Adding Swcnt Metallization Interlayer Between Metal and P–GaN Layers

Open Access
|Nov 2013

References

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DOI: https://doi.org/10.2478/jee-2013-0060 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
Language: English
Page range: 390 - 392
Published on: Nov 23, 2013
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year

© 2013 Jozef Liday, Peter Vogrinčič, Viliam Vretenár, Ivan Hotový, Mário Kotlár, Marián Marton, Vlastimil Řeháček, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons License.