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Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application Cover

Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

Engineering Management in Production and Services
Volume 11 (2019): Issue 2 (June 2019)
By: Mithun Sharma,  Sanjeev P. Sahni and  Shilpi Sharma  
Open Access
|Jul 2019

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DOI: https://doi.org/10.2478/emj-2019-0013 | Journal eISSN: 2543-912X | Journal ISSN: 2543-6597
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Language: English
Page range: 87 - 105
Submitted on: Dec 5, 2018
Accepted on: Jun 5, 2019
Published on: Jul 30, 2019
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Six Sigma,
quality,
silicon wafer,
lapping,
quality control,
total thickness variation,
wafer manufacturing
Related subjects:
Business and economics,
Business management,
Industries,
Transportation, logistics, air traffic, shipping,
Engineering,
Mechanical engineering,
Production technology,
Process engineering and industrial engineering

© 2019 Mithun Sharma, Sanjeev P. Sahni, Shilpi Sharma, published by Bialystok University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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