Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application
By: Mithun Sharma, Sanjeev P. Sahni and Shilpi Sharma
Authors
Language: English
Page range: 87 - 105
Submitted on: Dec 5, 2018
Accepted on: Jun 5, 2019
Published on: Jul 30, 2019
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2019 Mithun Sharma, Sanjeev P. Sahni, Shilpi Sharma, published by Bialystok University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.