Abstract
This study investigates the stress induced by thermal expansion in Printed Circuit Board (PCB) components. A simplified PCB model was used for electrical simulation via Siemens Simcenter FLOEFD 2412, determining temperature distribution from Joule heating in copper layers and vias. These temperatures were input into an Ansys Workbench 2023 R1 structural Finite Element Analysis (FEA). Results show Joule heating causes thermal expansion, and differing material temperatures and expansion coefficients generate stress and strain. Equivalent stress and strain exceeded material yield values, indicating potential copper cracking under high temperatures or thermal cycling. The thermal and structural FEA method effectively predicts thermal stress and strain in PCBs.