PCB Copper Traces Stress Due to Thermal Expansion Caused by Joule Heating Effect
Language: English
Page range: 37 - 44
Submitted on: May 7, 2025
Accepted on: Jun 1, 2025
Published on: Jul 8, 2025
Published by: Gheorghe Asachi Technical University of Iasi
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2025 George-Gabriel Chiriac, Georgiana Prodan-Chiriac, Cătălin Gabriel Dumitraş, Dragoş-Florin Chitariu, Neculai-Eduard Bumbu, Lucian Oancea, published by Gheorghe Asachi Technical University of Iasi
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