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PCB Copper Traces Stress Due to Thermal Expansion Caused by Joule Heating Effect Cover

PCB Copper Traces Stress Due to Thermal Expansion Caused by Joule Heating Effect

Bulletin of the Polytechnic Institute of Iași. Machine constructions Section
Volume 71 (2025): Issue 2 (June 2025)
By: George-Gabriel Chiriac,  Georgiana Prodan-Chiriac,  Cătălin Gabriel Dumitraş,  Dragoş-Florin Chitariu,  Neculai-Eduard Bumbu and  Lucian Oancea  
Open Access
|Jul 2025

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DOI: https://doi.org/10.2478/bipcm-2025-0013 | Journal eISSN: 2537-4869 | Journal ISSN: 1011-2855
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Language: English
Page range: 37 - 44
Submitted on: May 7, 2025
Accepted on: Jun 1, 2025
Published on: Jul 8, 2025
Published by: Gheorghe Asachi Technical University of Iasi
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
PCB,
Thermal Expansion,
Joule Heating,
FEA Simulation,
Thermal Stress
Related subjects:
Engineering,
Mechanical engineering,
Fundamentals of mechanical engineering,
Thermodynamics,
Production technology,
Mechatronics and automotive

© 2025 George-Gabriel Chiriac, Georgiana Prodan-Chiriac, Cătălin Gabriel Dumitraş, Dragoş-Florin Chitariu, Neculai-Eduard Bumbu, Lucian Oancea, published by Gheorghe Asachi Technical University of Iasi
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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