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Evaluation of Tensile Stress Relaxation of Selective Laser Sintering of PA2200 Material using the Maxwell-Wiechert Model Cover

Evaluation of Tensile Stress Relaxation of Selective Laser Sintering of PA2200 Material using the Maxwell-Wiechert Model

Acta Mechanica et Automatica
Volume 19 (2025): Issue 2 (June 2025)
By: Wiktor SZOT,  Mateusz RUDNIK,  Paweł SZCZYGIEŁ and  Natalia KOWALSKA  
Open Access
|Jun 2025

Authors

Wiktor SZOT

wszot@tu.kielce.pl

Faculty of Mechatronics and Mechanical Engineering, Department of Metrology and Unconventional Manufacturing Methods, Kielce University of Technology, Kielce, Poland

Mateusz RUDNIK

mrudnik@tu.kielce.pl

Faculty of Mechatronics and Mechanical Engineering, Department of Fundamentals of Mechanical Engineering and Mechanical Technology, Kielce University of Technology, Kielce, Poland

Paweł SZCZYGIEŁ

pszczygiel@tu.kielce.pl

Faculty of Mechatronics and Mechanical Engineering, Department of Metrology and Unconventional Manufacturing Methods, Kielce University of Technology, Kielce, Poland

Natalia KOWALSKA

nkowalska@tu.kielce.pl

Faculty of Mechatronics and Mechanical Engineering, Department of Fundamentals of Mechanical Engineering and Mechanical Technology, Kielce University of Technology, Kielce, Poland
DOI: https://doi.org/10.2478/ama-2025-0036 | Journal eISSN: 2300-5319 | Journal ISSN: 1898-4088
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Language: English
Page range: 292 - 299
Submitted on: Dec 16, 2024
Accepted on: Apr 14, 2025
Published on: Jun 30, 2025
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
3D printing,
stress relaxation,
Maxwell-Wiechert model,
SLS
Related subjects:
Engineering,
Electrical engineering,
Electronics,
Mechanical engineering,
Mechanics,
Bioengineering and biomedical engineering,
Biomechanics,
Civil engineering,
Environmental engineering

© 2025 Wiktor SZOT, Mateusz RUDNIK, Paweł SZCZYGIEŁ, Natalia KOWALSKA, published by Bialystok University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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