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Thermoelectric Properties of Ductile Doped Ag2S for Low Power Factor Application Cover

Thermoelectric Properties of Ductile Doped Ag2S for Low Power Factor Application

Open Access
|May 2024

Abstract

Wearable technologies encompass a diverse range of devices integral to our daily routines. Thermoelectric materials, known for their ability to convert heat differentials into electrical energy, are driving advancements in the automotive, aerospace, consumer electronics, and healthcare sectors. In automotive and aerospace, thermoelectric generators (TEGs) are utilized to enhance fuel efficiency and power onboard systems. In consumer electronics, thermoelectric coolers regulate temperature in devices like laptops and smartphones while also powering wearable technologies and sensors. Healthcare applications include wearable health monitors and drug delivery systems, utilizing thermoelectric devices for thermal management and diagnostics. Smartwatches, intelligent bracelets, sunglasses, and blood pressure sensors exemplify this trend, harnessing the potential of thermoelectric materials to generate power from temperature differentials. Ag2S is a ductile thermoelectric material with a potential use in thermoelectric devices. The aim of the article was to characterize the thermoelectric Ag2S -based material and describe the impact of chosen dopants on material properties. The Seebeck coefficient of pure Ag2S is -1051 μV.K−1, the Seebeck coefficient of Sb-doped material is −2.54 μV.K−1, and that of Ge-doped material is more positive at −87 μV.K−1. Material doped with Ge shows better thermoelectric properties.

DOI: https://doi.org/10.2478/aei-2024-0002 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
Language: English
Page range: 9 - 15
Submitted on: Feb 16, 2024
Accepted on: Apr 8, 2024
Published on: May 30, 2024
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2024 Gabriela Hricková, František Mihok, Peter Lukács, Róbert Džunda, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.