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Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity Cover

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Acta Electrotechnica et Informatica
Volume 21 (2021): Issue 4 (December 2021)
By: Daniel Dzivy,  Alena Pietrikova,  Olga Vrublevskaya and  Marina A. Shikun  
Open Access
|Apr 2022

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DOI: https://doi.org/10.2478/aei-2021-0001 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
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Language: English
Page range: 3 - 8
Submitted on: Feb 2, 2022
Accepted on: Mar 8, 2022
Published on: Apr 13, 2022
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
surface finish,
electrical resistivity,
multiple reflows
Related subjects:
Computer sciences,
Information technology,
Databases and data mining,
Engineering,
Electrical engineering,
Information technology

© 2022 Daniel Dzivy, Alena Pietrikova, Olga Vrublevskaya, Marina A. Shikun, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.

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