Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity
Authors
Daniel Dzivy
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Kosice
Alena Pietrikova
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Kosice
Olga Vrublevskaya
Research Institute for Physical Chemical Problems of the Belarusian State University, Minsk, Belarus
Marina A. Shikun
Belarusian State University, Minsk, Belarus
Language: English
Page range: 3 - 8
Submitted on: Feb 2, 2022
Accepted on: Mar 8, 2022
Published on: Apr 13, 2022
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
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© 2022 Daniel Dzivy, Alena Pietrikova, Olga Vrublevskaya, Marina A. Shikun, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.