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Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity Cover

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Acta Electrotechnica et Informatica
Volume 21 (2021): Issue 4 (December 2021)
By: Daniel Dzivy,  Alena Pietrikova,  Olga Vrublevskaya and  Marina A. Shikun  
Open Access
|Apr 2022

Authors

Daniel Dzivy

daniel.dzivy@tuke.sk

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Kosice

Alena Pietrikova

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Kosice

Olga Vrublevskaya

Research Institute for Physical Chemical Problems of the Belarusian State University, Minsk, Belarus

Marina A. Shikun

Belarusian State University, Minsk, Belarus
DOI: https://doi.org/10.2478/aei-2021-0001 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
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Language: English
Page range: 3 - 8
Submitted on: Feb 2, 2022
Accepted on: Mar 8, 2022
Published on: Apr 13, 2022
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
surface finish,
electrical resistivity,
multiple reflows
Related subjects:
Computer sciences,
Information technology,
Databases and data mining,
Engineering,
Electrical engineering,
Information technology

© 2022 Daniel Dzivy, Alena Pietrikova, Olga Vrublevskaya, Marina A. Shikun, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.

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