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Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition
Language: English
Page range: 66 - 81
Submitted on: Oct 24, 2024
Accepted on: Jan 6, 2025
Published on: Mar 26, 2025
Published by: Gdansk University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2025 Abid Hussain, Afzal Khan, Muhammad Imran Khan, Saif Ur Rehman, published by Gdansk University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.