Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition
Authors
Abid Hussain
Department of Mechanical Engineering, University of Engineering and Technology, Peshawar, Pakistan
Afzal Khan
Department of Mechanical Engineering, University of Engineering and Technology, Peshawar, Pakistan
Muhammad Imran Khan
Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and Technology, Pakistan
Saif Ur Rehman
abidhussain@uetpeshawar.edu.pk
Institute of Industrial Control System, Rawalpindi, Pakistan
Language: English
Page range: 66 - 81
Submitted on: Oct 24, 2024
Accepted on: Jan 6, 2025
Published on: Mar 26, 2025
Published by: Gdansk University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
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© 2025 Abid Hussain, Afzal Khan, Muhammad Imran Khan, Saif Ur Rehman, published by Gdansk University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.