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Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition Cover

Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition

Advances in Materials Science
Volume 25 (2025): Issue 1 (March 2025)
By: Abid Hussain,  Afzal Khan,  Muhammad Imran Khan and  Saif Ur Rehman  
Open Access
|Mar 2025

Authors

Abid Hussain

Department of Mechanical Engineering, University of Engineering and Technology, Peshawar, Pakistan

Afzal Khan

Department of Mechanical Engineering, University of Engineering and Technology, Peshawar, Pakistan

Muhammad Imran Khan

Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and Technology, Pakistan

Saif Ur Rehman

abidhussain@uetpeshawar.edu.pk

Institute of Industrial Control System, Rawalpindi, Pakistan
DOI: https://doi.org/10.2478/adms-2025-0004 | Journal eISSN: 2083-4799 | Journal ISSN: 1730-2439
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Language: English
Page range: 66 - 81
Submitted on: Oct 24, 2024
Accepted on: Jan 6, 2025
Published on: Mar 26, 2025
Published by: Gdansk University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
TiNiPd SMAs,
heat treatment,
SEM,
XRD,
DSC
Related subjects:
Materials sciences,
Functional and smart materials

© 2025 Abid Hussain, Afzal Khan, Muhammad Imran Khan, Saif Ur Rehman, published by Gdansk University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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