Abstract
Crucial for maintaining electronic device performance and longevity is effective thermal management. This study investigates two innovative heat sink configurations: the Square pin fin and the Slotted square pin fin. Assessed under varying conditions using Inventor 2018 and Autodesk Computational Fluid Dynamics (CFD) 2018, the Slotted square pin fin heat sink demonstrates a notable 18% increase in heat transfer area and a simultaneous 16% reduction in weight compared to the Square pin fin. Furthermore, a consistently lower base temperature is maintained, with an average reduction of around 10%. Importantly, 85% of total heat dissipation is contributed by the Slotted square pin fin, surpassing the Square pin fin configuration’s 80%. A commendable 19% reduction in thermal resistance is observed in the Slotted square pin fin compared to the Square pin fin. These insights underscore the advantages of the Slotted square pin fin heat sink in terms of heat transfer efficiency, weight reduction, lower temperatures and improved thermal resistance, contributing to advanced heat sink design and efficient thermal management strategies.