Professional Profile Map as a Powerful Educational Tool for Architects and Civil Engineers
Authors
Szymon Dawczyński
Department of Structural Engineering, Silesian University of Technology, Gliwice, Poland
Rafał Krzywoń
Department of Structural Engineering, Silesian University of Technology, Gliwice, Poland
Sigrid Mannsberger-Nindl
3s Research Laboratory – Forschungsverein, Vienna, Austria
Sabine Schwenk
3s Research Laboratory – Forschungsverein, Vienna, Austria
Arsenio Navarro
AIMPLAS – Asociaciónde Investigaciónde Materiales Plásticosy Conexas, Gustave Eiffel 4 (Parque Tecnológico), Valencia, Spain
Serafin Garcia
AIMPLAS – Asociaciónde Investigaciónde Materiales Plásticosy Conexas, Gustave Eiffel 4 (Parque Tecnológico), Valencia, Spain
Lorena Hernandez
AIMPLAS – Asociaciónde Investigaciónde Materiales Plásticosy Conexas, Gustave Eiffel 4 (Parque Tecnológico), Valencia, Spain
María Lladró
FEVEC – Federacion Valenciana de Empresarios de la Construcción, Arzobispo Fabiány Fuero 1, Valencia, Spain
Isabel María Balufo
FEVEC – Federacion Valenciana de Empresarios de la Construcción, Arzobispo Fabiány Fuero 1, Valencia, Spain
Valentina Kuzma
Gospodarska Zbornica Slovenije, Ljubljana, Slovenia
Andreja Palatinus
Gospodarska Zbornica Slovenije, Ljubljana, Slovenia
Eleni Damianou
PEDMEDE – Panhellenic Association of Engineers Contractors of Public Works, Athens, Greece
Paraskevi Angelakopoulou
PEDMEDE – Panhellenic Association of Engineers Contractors of Public Works, Athens, Greece
Language: English
Page range: 65 - 76
Submitted on: May 24, 2023
Accepted on: Aug 2, 2023
Published on: Oct 20, 2023
Published by: Silesian University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Related subjects:
© 2023 Szymon Dawczyński, Rafał Krzywoń, Sigrid Mannsberger-Nindl, Sabine Schwenk, Arsenio Navarro, Serafin Garcia, Lorena Hernandez, María Lladró, Isabel María Balufo, Valentina Kuzma, Andreja Palatinus, Eleni Damianou, Paraskevi Angelakopoulou, published by Silesian University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.