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Inspection of Packaged Integrated Circuits using Terahertz Radiation Cover

Inspection of Packaged Integrated Circuits using Terahertz Radiation

International Journal on Smart Sensing and Intelligent Systems
Volume 7 (2014): Issue 5 (January 2014)
By:  and    
Open Access
|Feb 2020
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DOI: https://doi.org/10.21307/ijssis-2019-056 | Journal eISSN: 1178-5608
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Language: English
Page range: 1 - 4
Published on: Feb 15, 2020
Published by: Macquarie University, Australia
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Keywords:
terahertz,
Time domain spectroscopy,
Wavelet transformation,
Wavelet denosing,
packaged integrated circuit inspection
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2020 Andreas Fritz, Thomas Arnold, published by Macquarie University, Australia
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Volume 7 (2014): Issue 5 (January 2014)
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