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Inspection of Packaged Integrated Circuits using Terahertz Radiation Cover

Inspection of Packaged Integrated Circuits using Terahertz Radiation

By: Andreas Fritz and  Thomas Arnold  
Open Access
|Feb 2020

Authors

Andreas Fritz

andreas.fritz@ctr.at

CTR Carinthian Tech Research AG Villach, Villach, Austria

Thomas Arnold

thomas.arnold@ctr.at

CTR Carinthian Tech Research AG Villach, Villach, Austria
Language: English
Page range: 1 - 4
Published on: Feb 15, 2020
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year

© 2020 Andreas Fritz, Thomas Arnold, published by Professor Subhas Chandra Mukhopadhyay
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.