Inspection of Packaged Integrated Circuits using Terahertz Radiation
By: Andreas Fritz and Thomas Arnold
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DOI: https://doi.org/10.21307/ijssis-2019-056 | Journal eISSN: 1178-5608
Language: English
Page range: 1 - 4
Published online: Feb 15, 2020
Published in print: Jan 1, 2014
Published by: International Journal on Smart Sensing and Intelligent Systems
In partnership with: Paradigm Publishing Services
Publication frequency: Volume open
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© 2020 Andreas Fritz, Thomas Arnold, published by International Journal on Smart Sensing and Intelligent Systems
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.