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Design of Temperature Sensitive Structure for Micromechanical Silicon Resonant Accelerometer Cover

Design of Temperature Sensitive Structure for Micromechanical Silicon Resonant Accelerometer

International Journal of Advanced Network, Monitoring and Controls
Volume 2 (2017): Issue 4 (January 2017)
By: Heng Li,  Libin Huang,  Qinqin Ran and  Songli Wang  
Open Access
|Apr 2018

Authors

Heng Li

1113762274@qq.com

School of Instrument Science and Engineering, Southeast University, Nanjing, China

Libin Huang

101010566@seu.edu.cn

School of Instrument Science and Engineering, Southeast University, Nanjing, China

Qinqin Ran

School of Instrument Science and Engineering, Southeast University, Nanjing, China

Songli Wang

618gdb104@facri.com

Aviation Key Laboratory of Science and Technology on Inertia, FACRI, Xi’an, China
DOI: https://doi.org/10.21307/iccnea.2017.91 | Journal eISSN: 2470-8038
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Language: English
Page range: 56 - 60
Published on: Apr 9, 2018
Published by: Xi’an Technological University
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Accelerometer,
MEMS,
Resonant,
Temperature error,
Temperature measurement structure
Related subjects:
Computer sciences,
Computer sciences, other

© 2018 Heng Li, Libin Huang, Qinqin Ran, Songli Wang, published by Xi’an Technological University
This work is licensed under the Creative Commons Attribution 4.0 License.

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