Abstract
A micromechanical silicon resonant accelerometer (MSRA) is a potential micro accelerometer with high accuracy. One of the most important factors affecting its performance is temperature. To research the effect of temperature on micromechanical silicon resonant accelerometer, this study based on the original micromechanical silicon resonant accelerometer, designs a chip-level temperature-sensitive structure which a pair of temperature resonators is arranged on both sides of the force resonator of the original accelerometer to ensure symmetry of the MSRA, as well as compares and selects the appropriate structure, fundamental frequency, and size. The ANSYS simulation is used to verify the rationality of the structure design. The MSRA is fabricated using the Deep Dry Silicon on Glass technique and packaged in metal shell, a measurement circuit is designed and a full temperature test is conducted. The results show that the resonant frequency of the temperature resonator is strongly sensitive to temperature changes but not sensitive to acceleration, and that it can reflects temperature change in the package cavity. Therefore, the temperature resonator can achieve accurate temperature measurement of accelerometer and can be used in temperature compensation.