Impact of Envelope Structure on the Solutions of Thermal Insulation from the Inside
Language: English
Page range: 123 - 134
Submitted on: Jun 5, 2018
|Accepted on: Oct 23, 2018
|Published on: Mar 2, 2022
Published by: Silesian University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
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© 2022 Bożena ORLIK-KOŻDOŃ, Agnieszka SZYMANOWSKA-GWIŻDŻ, published by Silesian University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.